The
semiconductor industry has recognized the need to be able
to accurately characterize the performance of semiconductor
devices and various package systems and related components
under a broad range of thermal environments. Manufacturers
of PC's and smaller scale devices have the requirement to
quantify the cooling air requirements for individual boards,
multi-board arrays and ancillary components.
ELD fabricates electronic
cooling wind tunnels that feature low turbulence, uniform
flow, easy operation, versatile test sections and are the
accepted industry and research standard for electronic cooling
flow test facilities. More than 30 of these wind tunnels are
in the laboratories of the world's leading semiconductor and
computer manufacturers.
For testing that requires the thermal characterization, pressure
drop characteristics and flow performance of electronic components
ELD offers Flow Benches.
FLOW BENCHES
Standard model Flow Benches are available from ELD for performance
characterization and in-situ testing of small and miniature
fans. These devices may also be employed for precision measurement
of mass flow rate and pressure loses through enclosures and
chassis and for determining static pressure requirements for
cooling airflow. These systems are adapted from the AMCA
Standard 210-85 / ASHREA
Standard 51-1985 Laboratory Methods of Testing Fans for Rating
Outlet Chamber Setup (Fig. 11) design. Accessory ducts and
heating components enable users to conduct thermal characterization
tests of heat sinks and similar devices.
FLOW BENCHES
